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US5G-TP - MCC

Description: Super Fast Recovery Rectifiers

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PCB Footprints
US5G-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - DO-214AB
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3D Models
US5G-TP - MCC  - 3D model - Diodes Moulded - DO-214AB
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US5G-TP Details

  • Manufacturer Part Number:

    US5G-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    2 PIN

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Application:

    ULTRA FAST RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    150 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    400 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    0.05 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

US5G-TP Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal performance of the US5G-TP involves keeping the signal traces as short as possible, using a solid ground plane, and avoiding vias and right-angle bends in the signal path. Additionally, it's recommended to use a 50-ohm impedance-controlled transmission line and to keep the component away from noise sources.
  • To ensure the reliability of the US5G-TP in high-temperature applications, it's recommended to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and keeping the component away from heat sources. Additionally, it's recommended to derate the component's power handling according to the temperature derating curve provided in the datasheet.
  • The maximum power handling of the US5G-TP is dependent on the frequency of operation and the temperature of the component. The power handling can be calculated using the formula provided in the datasheet, which takes into account the component's impedance, frequency, and temperature. It's recommended to consult the datasheet and application notes for more information.
  • The impedance of the US5G-TP can be matched to the system's impedance using impedance-matching techniques such as series or parallel resistive matching, or using a transmission line transformer. The recommended impedance-matching technique will depend on the specific application and system requirements. It's recommended to consult the datasheet and application notes for more information.
  • The typical insertion loss of the US5G-TP varies with frequency, and is typically specified in the datasheet. The insertion loss is usually highest at the highest frequencies and lowest at the lowest frequencies. The exact insertion loss will depend on the specific application and system requirements. It's recommended to consult the datasheet and application notes for more information.

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US5G-TP Overview

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