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US6M1TR - ROHM Semiconductor

Description: 4V Drive Nch + 2.5V Drive Pch MOSFET

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PCB Footprints
US6M1TR - ROHM Semiconductor PCB footprint - Other - Other - TUMT6
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3D Models
US6M1TR - ROHM Semiconductor  - 3D model - Other - TUMT6
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US6M1TR Details

  • Manufacturer Part Number:

    US6M1TR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    TUMT6, 6 PIN

  • Pin Count:

    6

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    1.4 A

  • Drain-source On Resistance-Max:

    0.38 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F6

  • JESD-609 Code:

    e2

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Copper (Sn/Cu)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

US6M1TR Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the US6M1TR is -40°C to 125°C, but it's essential to note that the device's performance may vary depending on the specific application and environmental conditions.
  • To ensure reliability in high-temperature applications, it's crucial to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and minimizing thermal resistance. Additionally, consider using a thermal simulation tool to model the device's thermal behavior.
  • When designing a PCB with the US6M1TR, it's essential to consider factors such as component placement, trace routing, and thermal management. Ensure that the device is placed in a thermally efficient location, and use wide traces to minimize resistance and inductance. Additionally, consider using a ground plane to reduce noise and improve signal integrity.
  • To prevent electrostatic discharge (ESD) damage, it's essential to follow proper handling and storage procedures for the US6M1TR. Use ESD-safe materials, such as wrist straps and mats, and ensure that all equipment and tools are properly grounded. Additionally, consider implementing ESD protection circuits in your design to protect the device from voltage surges.
  • The US6M1TR's power dissipation can have significant implications on the overall system design. It's essential to consider the device's power consumption and thermal characteristics when designing the system's power supply, thermal management, and cooling systems. Ensure that the system is designed to handle the device's power requirements and thermal output.

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US6M1TR Overview

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