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USB3330E-GL-TR - Microchip

Description: Microchip USB3330E-GL-TR, USB Transceiver, USB 2.0, 1.8 → 3.3 V, 25-Pin WLCSP

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PCB Footprints
USB3330E-GL-TR - Microchip PCB footprint - BGA - BGA - 25 Ball, WLCSP
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3D Models
USB3330E-GL-TR - Microchip  - 3D model - BGA - 25 Ball, WLCSP
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USB3330E-GL-TR Details

  • Manufacturer Part Number:

    USB3330E-GL-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    WLCSP-25

  • Pin Count:

    25

  • Manufacturer Package Code:

    WLCSP-25

  • Country Of Origin:

    South Korea

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    0

  • Bus Compatibility:

    UART

  • Clock Frequency-Max:

    26 MHz

  • External Data Bus Width:

    8

  • JESD-30 Code:

    S-PBGA-B25

  • JESD-609 Code:

    e1

  • Length:

    1.97 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    25

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA25,5X5,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    0.62 mm

  • Supply Current-Max:

    40 mA

  • Supply Voltage-Max:

    2 V

  • Supply Voltage-Min:

    1.6 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Width:

    1.97 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, UNIVERSAL SERIAL BUS

USB3330E-GL-TR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the USB traces as short as possible and away from noise sources. Use a common mode filter or ferrite bead to reduce EMI.
  • Follow the USB 3.0 specification guidelines for signal integrity, power delivery, and electrical requirements. Use the USB-IF certification program to ensure compliance.
  • The device has a thermal pad on the bottom. Ensure good thermal conductivity by using a thermal interface material and a heat sink if necessary. Keep the device away from heat sources and ensure good airflow.
  • Use a 3.3V power supply with a low dropout regulator (LDO) to ensure stable voltage. Add decoupling capacitors to reduce noise and ensure power integrity.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the USB lines to protect against electrostatic discharge. Follow the IEC 61000-4-2 standard for ESD testing.

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USB3330E-GL-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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