V18MLE0805LH footprint, schematic symbol and 3D model by LITTELFUSE

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V18MLE0805LH Details

The recommended land pattern for the V18MLE0805LH is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape.
Yes, the V18MLE0805LH is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at extreme temperatures.
To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the risk of overheating the component.
The recommended storage condition for the V18MLE0805LH is in a dry, cool place with a temperature range of 20°C to 30°C and humidity below 60%.
Yes, the V18MLE0805LH is designed to withstand vibrations up to 10G, making it suitable for applications with moderate vibration levels. However, it's essential to ensure proper mounting and soldering to prevent mechanical stress.

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