- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for V2PM10L-M3/H
- Part Number V2PM10L-M3/H
- Manufacturer Vishay
- Pin Count 2
- Part Category Schottky Diode
- Package Category Other
- Footprint Name Other - SMP (DO-220AA)_2
- Released Date Jun 20, 2021
- Last Modified Date Oct 15, 2025 5:15 PM UTC
- Pinout / Pin List Click Here (Member Only)
V2PM10L-M3/H Details
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Manufacturer Part Number:
V2PM10L-M3/H
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Country Of Origin:
Taiwan
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ECCN Code:
EAR99
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HTS Code:
8541.10.00.80
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Factory Lead Time:
5 Weeks
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Date Of Intro:
2019-06-27
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
6.07
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Additional Feature:
FREE WHEELING DIODE, LOW POWER LOSS
V2PM10L-M3/H Frequently Asked Questions (FAQs)
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A recommended PCB layout for optimal thermal performance would be to use a large copper area for the thermal pad, with multiple vias to the bottom layer to dissipate heat efficiently. Additionally, keeping the component away from other heat sources and using a thermal interface material can help.
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To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 217°C to 221°C. Apply a small amount of solder paste to the pads, and use a reflow oven or a hot air gun to solder the component. Avoid overheating or applying excessive force, which can damage the component.
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The maximum allowed voltage derating for the V2PM10L-M3/H is typically 80% of the maximum rated voltage. However, it's recommended to consult the datasheet and application notes for specific derating guidelines, as excessive derating can affect the component's reliability and performance.
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The V2PM10L-M3/H is designed for low-frequency applications. While it can be used in high-frequency applications, its performance may be affected due to increased losses and parasitic effects. It's recommended to consult the datasheet and application notes for specific guidance on high-frequency usage, and consider alternative components optimized for high-frequency applications.
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During assembly, apply a small amount of thermal interface material (TIM) to the thermal pad, and ensure the component is properly seated on the PCB. For rework, use a thermal pad removal tool to avoid damaging the component or PCB. Apply a new TIM and reassemble the component according to the manufacturer's guidelines.
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V2PM10L-M3/H Overview
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