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V35PW22-M3/I - Vishay

Description: DIODE SCHOTTKY 200V 35A SLIMDPAK

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PCB Footprints
V35PW22-M3/I - Vishay PCB footprint - Other - Other - SlimDPAK(TO-252AE)_2024
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3D Models
V35PW22-M3/I - Vishay  - 3D model - Other - SlimDPAK(TO-252AE)_2024
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V35PW22-M3/I Details

  • Manufacturer Part Number:

    V35PW22-M3/I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DPAK-3/2

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Date Of Intro:

    2020-01-19

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.55

  • Additional Feature:

    FREE WHEELING DIODE, LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.99 V

  • JEDEC-95 Code:

    TO-252AE

  • JESD-30 Code:

    R-PSSO-G2

  • Non-rep Pk Forward Current-Max:

    260 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    35 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    350 µA

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

V35PW22-M3/I Frequently Asked Questions (FAQs)

  • A symmetrical layout with a central grounding point is recommended to minimize electromagnetic interference (EMI) and ensure optimal performance. Keep the input and output traces separate and as short as possible.
  • The device has a high power dissipation rating. Ensure good airflow around the component, and consider using a heat sink or thermal pad to maintain a safe operating temperature (below 150°C).
  • Follow the standard reflow soldering profile: preheat to 150°C, peak temperature of 260°C, and a cooling rate of 4°C/s. Avoid exceeding the maximum soldering temperature of 260°C.
  • Yes, but ensure the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method to prevent damage from vibration. Consult the manufacturer's guidelines for vibration testing.
  • Common issues include overheating, electrical overstress, and soldering defects. Check for proper thermal management, ensure correct polarity and voltage, and inspect solder joints for defects. Consult the datasheet and application notes for troubleshooting guides.

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V35PW22-M3/I Overview

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Part Image V35PW22HM3_A/I Vishay Intertechnologies

Rectifier Diode, Schottky, 1 Phase, 1 Element, 35A, 200V V(RRM), Silicon, TO-252AE