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V62/06621-01YE - Texas Instruments

Description: V62/06621-01YE

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PCB Footprints
V62/06621-01YE - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DCK
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V62/06621-01YE - Texas Instruments  - 3D model - SOT23 (5-Pin) - DCK
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V62/06621-01YE Details

  • Manufacturer Part Number:

    V62/06621-01YE

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    5

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUFFER

  • Max I(ol):

    0.032 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Inputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.01 mA

  • Prop. Delay@Nom-Sup:

    5.5 ns

  • Propagation Delay (tpd):

    11 ns

  • Qualification Status:

    Not Qualified

  • Schmitt Trigger:

    YES

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    6.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.25 mm

V62/06621-01YE Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as using a solid ground plane, minimizing trace lengths, and avoiding vias under the device. Additionally, ensure that the input and output traces are well-separated to reduce noise and crosstalk.
  • The V62/06621-01YE can deliver high currents, so it's crucial to ensure that the PCB traces and components can handle the current. Use thick traces (at least 1 oz copper) and consider using multiple vias to reduce resistance. Also, ensure that the output capacitors are rated for high currents and have low ESR to minimize voltage drops.
  • The V62/06621-01YE has a high power dissipation, so thermal management is critical. Use a heat sink with a thermal interface material (TIM) to reduce the thermal resistance. Ensure good airflow around the device, and consider using a fan or heat sink with a built-in fan. Monitor the device temperature and adjust the thermal design accordingly.
  • To ensure EMC, follow good design practices such as using a solid ground plane, minimizing loop areas, and using shielding where necessary. Ensure that the input and output cables are well-shielded and use ferrite beads or common-mode chokes to reduce EMI. Also, consider using a metal enclosure to reduce radiation.
  • The V62/06621-01YE is a high-reliability device with a typical lifespan of 10-15 years. However, this can vary depending on the operating conditions, such as temperature, humidity, and power cycling. Ensure that the device is operated within the recommended specifications, and consider using redundancy or backup systems for critical applications.

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V62/06621-01YE Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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