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V62/06630-01XE - Texas Instruments

Description: Logic Gates Mil Enhance Dual 2- Input Pos-OR Gate

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V62/06630-01XE - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DCU (R-PDSO-G8)
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V62/06630-01XE - Texas Instruments  - 3D model - Small Outline Packages - DCU (R-PDSO-G8)
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V62/06630-01XE Details

  • Manufacturer Part Number:

    V62/06630-01XE

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    VSSOP-8

  • Pin Count:

    8

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    2.3 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    OR GATE

  • Max I(ol):

    0.032 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Inputs:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP8,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.01 mA

  • Prop. Delay@Nom-Sup:

    5.8 ns

  • Propagation Delay (tpd):

    11 ns

  • Qualification Status:

    Not Qualified

  • Schmitt Trigger:

    NO

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

V62/06630-01XE Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as keeping the input and output traces separate, using a solid ground plane, and minimizing parasitic inductance and capacitance.
  • Proper thermal management is crucial. Ensure good airflow, use a heat sink if necessary, and avoid exposing the device to extreme temperatures during storage or operation. Monitor the device's temperature using the thermal pad or an external temperature sensor.
  • Exceeding the maximum ratings can lead to permanent damage, reduced lifespan, or even catastrophic failure. Ensure that the device operates within the specified voltage, current, and power dissipation limits to avoid these consequences.
  • Start by reviewing the datasheet and application notes, then check the PCB layout, component values, and soldering quality. Use oscilloscopes or logic analyzers to debug the circuit, and consider consulting with Texas Instruments' support team or a qualified engineer.
  • Yes, the V62/06630-01XE is a high-frequency device, and proper EMI/EMC design practices are essential. Use shielding, filtering, and grounding techniques to minimize electromagnetic interference and ensure compliance with relevant regulations.

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V62/06630-01XE Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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