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VCUT10A1-SD0-G4-08 - Vishay

Description: TVS DIODES 10V CLP0603 Bidirectional Symmetrical (BiSy) Single Line ESD-Protection Diode in Silicon Package

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VCUT10A1-SD0-G4-08 - Vishay - PCB symbol
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PCB Footprints
VCUT10A1-SD0-G4-08 - Vishay PCB footprint - Other - Other - VCUT10A1-SD0-G4-08-2
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VCUT10A1-SD0-G4-08 - Vishay - 3D model - Other - VCUT10A1-SD0-G4-08-2
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VCUT10A1-SD0-G4-08 Details

  • Manufacturer Part Number:

    VCUT10A1-SD0-G4-08

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Additional Feature:

    LOW CAPACITANCE

  • Breakdown Voltage-Max:

    13 V

  • Breakdown Voltage-Min:

    11 V

  • Breakdown Voltage-Nom:

    12 V

  • Clamping Voltage-Max:

    18 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PBCC-N2

  • Non-rep Peak Rev Power Dis-Max:

    72 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2,4-5

  • Rep Pk Reverse Voltage-Max:

    10 V

  • Reverse Current-Max:

    0.05 µA

  • Reverse Test Voltage:

    10 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

VCUT10A1-SD0-G4-08 Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the device should be connected to a large copper area on the PCB to dissipate heat. The copper area should be at least 1 inch x 1 inch in size and connected to a ground plane to ensure good heat dissipation.
  • Use a soldering iron with a temperature of 250°C to 260°C. Apply a small amount of solder paste to the thermal pad and reflow the solder at a temperature of 220°C to 240°C for 30 seconds to 60 seconds.
  • The maximum operating temperature range for the VCUT10A1-SD0-G4-08 is -40°C to 150°C. However, the device can be stored at temperatures between -40°C and 200°C.
  • Handle the device by the edges to prevent damage to the electrical connections. Avoid touching the electrical connections or the thermal pad to prevent damage from electrostatic discharge.
  • Use a wire bonding process with a ball bonder or a wedge bonder. The bonding temperature should be between 150°C to 200°C, and the bonding force should be between 10 gf to 30 gf.

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VCUT10A1-SD0-G4-08 Overview

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