The recommended PCB footprint for the VDMR10A1 is a rectangular pad with a size of 2.5 mm x 1.5 mm, with a thermal via connecting to a larger copper area for heat dissipation.
To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes the risk of overheating the component.
The maximum allowed voltage derating for the VDMR10A1 is 80% of the maximum rated voltage, which is 10 V. Therefore, the maximum allowed voltage derating is 8 V.
The power dissipation of the VDMR10A1 can be calculated using the formula: Pd = (Vin - Vout) x Iout, where Vin is the input voltage, Vout is the output voltage, and Iout is the output current.
The thermal resistance of the VDMR10A1 is typically around 20°C/W, which means that for every watt of power dissipation, the junction temperature will increase by 20°C.
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VDMR10A1 Overview
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