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VEC2616-TL-H - onsemi

Description: Dual N/P-channel MOSFET Transistor, 8-pin VEC

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PCB Footprints
VEC2616-TL-H - onsemi PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - VEC8 7012-002
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3D Models
VEC2616-TL-H - onsemi  - 3D model - SO Transistor Flat Lead - VEC8 7012-002
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VEC2616-TL-H Details

  • Manufacturer Part Number:

    VEC2616-TL-H

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOT-28FL, 8 PIN

  • Pin Count:

    8

  • Manufacturer Package Code:

    318AH

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    3 A

  • Drain-source On Resistance-Max:

    0.08 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    1 W

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN BISMUTH

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

VEC2616-TL-H Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
  • Use a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. Avoid wave soldering and hand soldering.
  • Use wide, thick traces (≥ 1 oz copper) and ensure a low-impedance path for high-current signals. Consider using a dedicated power plane and decoupling capacitors.
  • Implement ESD protection devices (e.g., TVS diodes) on the input and output pins. Ensure a robust PCB design with a solid ground plane and minimal signal routing.

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VEC2616-TL-H Overview

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