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VG6640AB1M - STMicroelectronics

Description: Automotive 1.3 megapixel high-dynamic range image sensor

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VG6640AB1M - STMicroelectronics - PCB symbol
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VG6640AB1M - STMicroelectronics PCB footprint - BGA - BGA - Im2BGA_2022
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VG6640AB1M - STMicroelectronics - 3D model - BGA - Im2BGA_2022
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VG6640AB1M Details

  • Manufacturer Part Number:

    VG6640AB1M

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    IM2BGA

  • Manufacturer Package Code:

    M2BGA 9X9.3X1.375 100 F10X10 PI

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • Manufacturer:

    STMicroelectronics

  • Additional Feature:

    AEC-Q100; ELECTRICAL ROLLING SHUTTER

  • Array Type:

    FRAME

  • Body Breadth:

    9 mm

  • Body Height:

    1.015 mm

  • Body Length or Diameter:

    9.3 mm

  • Dynamic Range:

    132 dB

  • Frame Rate:

    60 fps

  • Horizontal Pixel:

    1304

  • JESD-609 Code:

    e1

  • Mounting Feature:

    SURFACE MOUNT

  • Operating Current-Max:

    4 mA

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Optical Format:

    1/2.7 inch

  • Output Interface Type:

    I2C INTERFACE

  • Output Range:

    0.15-1.65V

  • Output Type:

    DIGITAL VOLTAGE

  • Package Shape/Style:

    RECTANGULAR

  • Pixel Size:

    3.75X3.75 µm

  • Sensors/Transducers Type:

    IMAGE SENSOR,CMOS

  • Spectral Response (nm):

    350-950

  • Supply Voltage-Max:

    1.32 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Termination Type:

    SOLDER

  • Vertical Pixel:

    980

VG6640AB1M Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN2153, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The VG6640AB1M has a high power dissipation, so it's essential to implement proper thermal management. This can be achieved by using a heat sink, thermal interface material, and ensuring good airflow around the device. The thermal resistance (RthJA) is specified in the datasheet, and the application note AN2153 provides more detailed guidance.
  • While the datasheet specifies the maximum output current and voltage, it's essential to consider the device's thermal limitations and ensure that the output current and voltage do not exceed the recommended values for extended periods. Additionally, the output current should be derated based on the ambient temperature and the device's thermal resistance.
  • To protect the VG6640AB1M from overvoltage and overcurrent conditions, it's recommended to use external protection circuits, such as overvoltage protection (OVP) and overcurrent protection (OCP) devices. These circuits can be implemented using discrete components or integrated circuits specifically designed for this purpose.
  • The VG6640AB1M can generate electromagnetic interference (EMI) and radio-frequency interference (RFI) due to its high-frequency operation. To minimize EMI and RFI, it's essential to follow proper PCB layout and design guidelines, use shielding and filtering techniques, and ensure that the device is properly grounded and decoupled.

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VG6640AB1M Overview

Use the download button to access the VG6640AB1M schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like VG664, or try a keyword search, such as Image Sensors

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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