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VGSOT05C-G3-08 - Vishay

Description: • Two-line unidirectional ESD protection diode • Common anode • Can be used as bidirectional protection diode • ESD immunity acc. IEC 61000-4-2 and ISO 10605 ± 30 kV contact discharge ± 30 kV air discharge • ESD capability according to AEC-Q101: human body model: class H3B: > 8 kV • e3 - Sn • AEC-Q101 qualified available • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912

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Symbol
VGSOT05C-G3-08 - Vishay - PCB symbol
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PCB Footprints
VGSOT05C-G3-08 - Vishay PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23_2024-4
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3D Models
VGSOT05C-G3-08 - Vishay - 3D model - SOT23 (3-Pin) - SOT-23_2024-4
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VGSOT05C-G3-08 Details

  • Manufacturer Part Number:

    VGSOT05C-G3-08

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23, 3 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6

  • Breakdown Voltage-Max:

    8 V

  • Breakdown Voltage-Min:

    6 V

  • Breakdown Voltage-Nom:

    6.8 V

  • Clamping Voltage-Max:

    14 V

  • Configuration:

    COMMON ANODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    44 W

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2, 4-5; ISO 10605

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Reverse Current-Max:

    10 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

VGSOT05C-G3-08 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the VGSOT05C-G3-08 is a rectangular pad with dimensions of 1.5 mm x 0.8 mm, with a 0.5 mm diameter hole in the center for the thermal pad. The pad should be connected to a large copper area to ensure good thermal dissipation.
  • To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pad. Use a reflow oven or a hot air gun to solder the component, and avoid applying excessive pressure or vibration during the soldering process.
  • The maximum allowed voltage on the gate pin of the VGSOT05C-G3-08 is ±20 V, with a maximum transient voltage of ±30 V. Exceeding these voltage limits can damage the device.
  • To protect the VGSOT05C-G3-08 from ESD, handle the device with an anti-static wrist strap or mat, and ensure that the PCB and assembly equipment are grounded. Use ESD-sensitive packaging and storage materials, and avoid touching the device's pins or exposed die.
  • The thermal resistance of the VGSOT05C-G3-08 is RθJA = 45°C/W (junction-to-ambient) and RθJC = 2.5°C/W (junction-to-case). These values are typical and may vary depending on the specific application and PCB design.

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VGSOT05C-G3-08 Overview

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