CUI recommends a PCB layout with a large copper area for heat dissipation, and thermal vias to connect to a heat sink or a metal core PCB. A minimum of 2oz copper thickness is recommended. Additionally, a thermal interface material (TIM) with a thermal conductivity of 1-2 W/m-K should be used between the module and the heat sink.
CUI recommends following the recommended reflow profile, using a solder paste with a melting point of 217°C, and ensuring the module is properly aligned on the PCB. Avoid applying excessive force or pressure during the soldering process, and ensure the module is not exposed to temperatures above 240°C for more than 10 seconds.
CUI recommends derating the input voltage by 10-15% to ensure reliable operation and to account for voltage transients and spikes. This means that for a 24V input, the maximum allowable voltage should not exceed 26.4V (24V x 1.1).
CUI recommends checking the input voltage, output voltage, and current to ensure they are within the specified ranges. Use an oscilloscope to check for voltage ripple, noise, and transients. Also, check the module's temperature and ensure it is within the specified operating range. If issues persist, contact CUI's technical support for further assistance.
CUI's VHB200W-Q24-S28 module is designed to meet a minimum of 500,000 hours MTBF (Mean Time Between Failures) at 40°C ambient temperature, and 300,000 hours at 80°C ambient temperature. The module is also designed to meet the requirements of IEC 62368-1 and UL 62368-1 for safety and reliability.
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VHB200W-Q24-S28 Overview
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