CUI recommends a PCB layout with a large copper area for heat dissipation, and thermal vias to connect to a heat sink or a metal core PCB. A minimum of 2oz copper thickness is recommended. Additionally, a thermal interface material (TIM) can be used to improve heat transfer between the module and the heat sink.
To ensure reliable startup and shutdown, CUI recommends a soft-start circuit to limit inrush current, and a shutdown circuit to prevent back-EMF damage. The module's enable pin should be driven by a logic signal with a rise and fall time of 1-2ms to prevent oscillations.
CUI provides derating curves for temperature, altitude, and humidity in their application notes. In general, the module's power rating decreases by 1% for every 1°C increase above 40°C, and by 1% for every 1,000ft increase above sea level. Humidity derating is typically not required, but the module should be protected from condensation and moisture ingress.
Yes, the VHB350-D24-S24 can be used in redundant or parallel configurations, but CUI recommends consulting their application notes and design guides for specific guidance on synchronization, current sharing, and fault tolerance. Additionally, the system designer should ensure that the modules are properly isolated and protected from each other.
CUI recommends following proper EMI and EMC design practices, including using a metal enclosure, shielding, and filtering. The module's switching frequency is typically in the range of 200-400kHz, and the system designer should ensure that the module is properly decoupled and filtered to meet relevant EMI and EMC standards.
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VHB350-D24-S24 Overview
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