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VIPER113LSTR - STMicroelectronics

Description: Energy saving off-line high voltage converter

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VIPER113LSTR - STMicroelectronics - PCB symbol
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VIPER113LSTR - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SSOP10
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VIPER113LSTR - STMicroelectronics - 3D model - Small Outline Packages - SSOP10
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VIPER113LSTR Details

  • Manufacturer Part Number:

    VIPER113LSTR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SSOP-10

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    7

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    30 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    9 V

  • JESD-30 Code:

    R-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SOP10,.24,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    1.5 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    66 kHz

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

VIPER113LSTR Frequently Asked Questions (FAQs)

  • A good PCB layout for VIPER113LSTR involves keeping the input and output capacitors close to the IC, using a solid ground plane, and minimizing the length of the traces between the IC and the capacitors. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the input voltage is within the recommended range, and the output capacitor is of sufficient value and type. Additionally, consider adding a small capacitor (e.g., 10nF) between the VCC pin and GND to improve stability.
  • The VIPER113LSTR is rated for operation from -40°C to 150°C (junction temperature). However, the maximum ambient temperature range depends on the specific application and the thermal design of the system. As a general guideline, the ambient temperature should be kept below 85°C to ensure reliable operation.
  • Yes, the VIPER113LSTR is suitable for high-reliability applications. It is manufactured using a robust process and has undergone rigorous testing to ensure its reliability. However, it is essential to follow proper design and manufacturing guidelines to ensure the reliability of the overall system.
  • To troubleshoot issues with the VIPER113LSTR, start by verifying the input voltage, output voltage, and current consumption. Check for any signs of overheating, and ensure that the PCB layout and component values are correct. Use an oscilloscope to check for any oscillations or noise on the output. If the issue persists, consult the datasheet and application notes for further guidance.

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VIPER113LSTR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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