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VLCF5024T-330MR50-2 - TDK

Description: SMD / SMT Inductors (Coils), L=33μH, L x W x T :

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VLCF5024T-330MR50-2 - TDK PCB footprint - Other - Other - VLCF5024-2
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VLCF5024T-330MR50-2 - TDK  - 3D model - Other - VLCF5024-2
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VLCF5024T-330MR50-2 Details

  • Manufacturer Part Number:

    VLCF5024T-330MR50-2

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.4

  • Case/Size Code:

    2020

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.275 Ω

  • Inductance-Nom (L):

    33 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    2.4 mm

  • Package Length:

    5 mm

  • Package Style:

    SMT

  • Package Width:

    5 mm

  • Packing Method:

    TR, 7 Inch

  • Rated Current-Max:

    1.24 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

VLCF5024T-330MR50-2 Frequently Asked Questions (FAQs)

  • The recommended land pattern for VLCF5024T-330MR50-2 can be found in the TDK Corporation's recommended land pattern document, which is usually available on their website or through their customer support. The document provides detailed information on the recommended pad size, shape, and spacing for optimal performance and reliability.
  • Thermal management is critical for the reliability and performance of VLCF5024T-330MR50-2. It is recommended to use a thermal pad or a heat sink to dissipate heat away from the component. The thermal pad or heat sink should be designed to ensure good thermal contact with the component, and the thermal interface material should be selected based on the operating temperature range and power dissipation requirements.
  • The maximum operating temperature range for VLCF5024T-330MR50-2 is -40°C to +125°C, as specified in the datasheet. However, it is recommended to derate the component's performance and reliability at higher temperatures to ensure optimal operation and to prevent thermal runaway.
  • To ensure the reliability of VLCF5024T-330MR50-2 in high-vibration environments, it is recommended to use a robust mounting method, such as a screw-down or adhesive mounting, to secure the component to the PCB. Additionally, the PCB should be designed to minimize flexure and vibration, and the component should be located in a area with minimal vibration and shock.
  • The recommended storage and handling procedure for VLCF5024T-330MR50-2 is to store the components in their original packaging, away from direct sunlight, moisture, and extreme temperatures. The components should be handled with care to prevent mechanical damage, and electrostatic discharge (ESD) precautions should be taken to prevent damage from static electricity.

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VLCF5024T-330MR50-2 Overview

Use the download button to access the VLCF5024T-330MR50-2 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like VLCF5, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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