VLMU3500-405-120 footprint, schematic symbol and 3D model by Vishay

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VLMU3500-405-120 Details

The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad with a minimum size of 10mm x 10mm, and using a minimum of 2oz copper thickness. Additionally, it is recommended to use thermal vias to dissipate heat from the device to the bottom layer of the PCB.
To ensure reliable soldering of the VLMU3500-405-120, it is recommended to use a soldering temperature of 260°C (500°F) for a maximum of 10 seconds. Additionally, the device should be soldered using a solder with a melting point of 217°C (423°F) or higher.
The maximum allowed voltage derating for the VLMU3500-405-120 is 80% of the rated voltage. This means that if the device is rated for 120V, the maximum allowed voltage derating would be 96V.
The VLMU3500-405-120 is an ESD-sensitive device and requires proper handling and storage to prevent damage. It is recommended to use an ESD wrist strap or mat when handling the device, and to store it in an ESD-protective package when not in use.
The recommended storage temperature range for the VLMU3500-405-120 is -40°C to 100°C (-40°F to 212°F), and the recommended storage humidity range is 20% to 80% relative humidity.

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