VLMU35CT21-275-120 footprint, schematic symbol and 3D model by Vishay

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VLMU35CT21-275-120 Details

The recommended PCB footprint for the VLMU35CT21-275-120 is a rectangular pad with dimensions of 35mm x 21mm, with a 1.5mm x 1.5mm thermal pad in the center. The pad should be solder-mask defined with a minimum solderable area of 30mm x 16mm.
To ensure proper thermal management, it is recommended to use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K between the device and the heat sink. The heat sink should be designed to provide adequate airflow and have a thermal resistance of less than 10°C/W.
The maximum allowed voltage derating for the VLMU35CT21-275-120 is 10% of the rated voltage, which is 275V. Therefore, the maximum allowed voltage derating is 27.5V.
The VLMU35CT21-275-120 is not designed for use in high-humidity environments. It is recommended to use a conformal coating or potting compound to protect the device from moisture and humidity. Additionally, the device should be stored in a dry environment with a relative humidity of less than 60%.
The recommended soldering temperature profile for the VLMU35CT21-275-120 is a peak temperature of 260°C for a maximum of 10 seconds, with a ramp-up rate of 3°C/s and a ramp-down rate of 6°C/s.

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