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VN820SPTR-E - STMicroelectronics

Description: High Side Driver

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VN820SPTR-E - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - PowerSO-10_1_2022
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VN820SPTR-E - STMicroelectronics  - 3D model - Small Outline Packages - PowerSO-10_1_2022
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VN820SPTR-E Details

  • Manufacturer Part Number:

    VN820SPTR-E

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    ROHS COMPLIANT, POWER, SO-10

  • Pin Count:

    10

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    1

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    9.4 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Output Current Flow Direction:

    SOURCE

  • Output Current-Max:

    9 A

  • Output Peak Current Limit-Nom:

    13 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOP10,.55FL

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    250

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.75 mm

  • Supply Voltage-Max:

    36 V

  • Supply Voltage-Min:

    5.5 V

  • Supply Voltage-Nom:

    13 V

  • Surface Mount:

    YES

  • Technology:

    MOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

VN820SPTR-E Frequently Asked Questions (FAQs)

  • A good PCB layout for VN820SPTR-E involves keeping the high-current paths short and wide, using a solid ground plane, and placing the device close to the power source. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • Proper cooling of VN820SPTR-E involves providing a heat sink with a thermal resistance of less than 10°C/W, ensuring good airflow, and keeping the device away from other heat sources. A thermal interface material can also be used to improve heat transfer.
  • When handling VN820SPTR-E, precautions include using an anti-static wrist strap or mat, handling the device by the body and not the pins, and avoiding bending or flexing the pins. It's also important to store the device in an anti-static bag or wrap.
  • To troubleshoot issues with VN820SPTR-E, start by checking the power supply voltage, current, and temperature. Verify that the device is properly soldered and that the PCB layout is correct. Use a thermal camera or thermometer to check for hotspots, and consult the datasheet and application notes for guidance.
  • When designing a power supply using VN820SPTR-E, key considerations include selecting the right input and output capacitors, choosing the optimal switching frequency, and ensuring proper thermal management. It's also important to follow the recommended layout and PCB design guidelines.

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VN820SPTR-E Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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