VND3NV04-E footprint, schematic symbol and 3D model by STMicroelectronics

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PCB Footprints

VND3NV04-E - STMicroelectronics PCB footprint - Other - Other - TO-252 (DPAK)-2026-7.1

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Part Number VND3NV04-E
Manufacturer STMicroelectronics
Pin Count 3
Part Category Integrated Circuit
Package Category Other
Footprint Name Other - TO-252 (DPAK)-2026-7.1
Released Date Apr 23, 2026
Last Modified Date Apr 23, 2026 6:45 AM UTC
Pinout / Pin List Click Here (Member Only)

VND3NV04-E Details

Manufacturer Part Number:
VND3NV04-E
Brand Name:
STMicroelectronics
Rohs Code:
Yes
Part Life Cycle Code:
Obsolete
Part Package Code:
TO-252
Package Description:
ROHS COMPLIANT, TO-252, DPAK, 3 PIN
Pin Count:
3
ECCN Code:
EAR99
HTS Code:
8542.39.00.60
Manufacturer:
STMicroelectronics
YTEOL:
0
Built-in Protections:
TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL
Interface IC Type:
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 Code:
R-PSSO-G2
JESD-609 Code:
e3
Length:
6.5 mm
Moisture Sensitivity Level:
3
Number of Functions:
1
Number of Terminals:
2
Output Current Flow Direction:
SINK
Output Peak Current Limit-Nom:
5 A
Package Body Material:
PLASTIC/EPOXY
Package Code:
TO-252
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
2.63 mm
Surface Mount:
YES
Terminal Finish:
TIN
Terminal Form:
GULL WING
Terminal Pitch:
2.28 mm
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
30
Turn-off Time:
10 µs
Turn-on Time:
1.35 µs
Width:
6.1 mm

VND3NV04-E Frequently Asked Questions (FAQs)

The maximum operating temperature range for the VND3NV04-E is -40°C to 150°C.
To ensure reliability, it's recommended to follow the recommended operating conditions, use a suitable thermal management system, and consider derating the device's power handling capabilities at high temperatures.
A recommended PCB layout and thermal management strategy for the VND3NV04-E involves using a multi-layer PCB with thermal vias, a heat sink, and a thermal interface material to dissipate heat efficiently.
To protect the VND3NV04-E from ESD, it's recommended to follow proper handling and storage procedures, use ESD-protective packaging, and implement ESD protection circuits in the design.
The recommended soldering and assembly guidelines for the VND3NV04-E involve using a soldering temperature of 260°C (max), a soldering time of 10 seconds (max), and following the recommended PCB assembly and reflow soldering procedures.

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VND3NV04-E Overview

Use the download button to access the VND3NV04-E schematic symbol and PCB footprint.

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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