VND5E160MJ-E footprint, schematic symbol and 3D model by STMicroelectronics

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Datasheet Download Datasheet
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Part Number VND5E160MJ-E
Manufacturer STMicroelectronics
Pin Count 13
Part Category Integrated Circuit
Package Category Small Outline Packages
Footprint Name Small Outline Packages - PowerSSO-12_2022
Released Date Apr 22, 2026
Last Modified Date Apr 22, 2026 11:35 AM UTC
Pinout / Pin List Click Here (Member Only)

VND5E160MJ-E Details

Manufacturer Part Number:
VND5E160MJ-E
Brand Name:
STMicroelectronics
Rohs Code:
Yes
Part Life Cycle Code:
Obsolete
Part Package Code:
SOIC
Package Description:
ROHS COMPLIANT, SSO-12
Pin Count:
12
ECCN Code:
EAR99
HTS Code:
8542.39.00.60
Manufacturer:
STMicroelectronics
YTEOL:
0
Built-in Protections:
TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE
Driver Number of Bits:
2
Interface IC Type:
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 Code:
R-PDSO-G12
JESD-609 Code:
e3
Length:
4.9 mm
Moisture Sensitivity Level:
3
Number of Functions:
1
Number of Terminals:
12
Output Current Flow Direction:
SOURCE
Package Body Material:
PLASTIC/EPOXY
Package Code:
HLSSOP
Package Equivalence Code:
SOP12,.25,32
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1.62 mm
Supply Voltage-Max:
28 V
Supply Voltage-Min:
4.5 V
Supply Voltage-Nom:
13 V
Surface Mount:
YES
Technology:
CMOS
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Pitch:
0.8 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Turn-off Time:
15 µs
Turn-on Time:
10 µs
Width:
3.9 mm

VND5E160MJ-E Frequently Asked Questions (FAQs)

The maximum operating temperature range for the VND5E160MJ-E is -40°C to 150°C, as specified in the datasheet. However, it's recommended to operate the device within a temperature range of -20°C to 125°C for optimal performance and reliability.
To ensure proper soldering, follow the recommended soldering profile and temperature guidelines provided in the datasheet. Additionally, use a solder with a melting point above 217°C to prevent damage to the device. It's also recommended to use a reflow oven with a controlled temperature profile to ensure consistent soldering results.
For optimal performance and thermal management, it's recommended to follow the PCB layout guidelines provided in the datasheet. This includes keeping the device away from heat sources, using a solid ground plane, and ensuring good thermal conductivity between the device and the PCB. Additionally, consider using a thermal pad or heat sink to dissipate heat generated by the device.
To prevent damage during storage and shipping, handle the VND5E160MJ-E with care to avoid mechanical stress, bending, or flexing. Store the devices in their original packaging or in a protective container to prevent moisture and contamination. Avoid exposing the devices to extreme temperatures, humidity, or electrostatic discharge (ESD).
To ensure the VND5E160MJ-E meets the required specifications and performance, it's recommended to perform thorough testing and validation procedures, including functional testing, parametric testing, and environmental testing. Follow the testing guidelines provided in the datasheet and relevant industry standards, such as AEC-Q100 for automotive applications.

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VND5E160MJ-E Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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