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VND830SP-E - STMicroelectronics

Description: Gate Drivers Double Ch High Side

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VND830SP-E - STMicroelectronics PCB footprint - Other - Other - VND830SP-E-5
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VND830SP-E Details

  • Manufacturer Part Number:

    VND830SP-E

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-10

  • Pin Count:

    10

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    2

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    9.4 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Output Peak Current Limit-Nom:

    9 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOP10,.55

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    250

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    3.75 mm

  • Supply Current-Max:

    14 mA

  • Supply Voltage-Max:

    36 V

  • Supply Voltage-Min:

    5.5 V

  • Supply Voltage-Nom:

    13 V

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

VND830SP-E Frequently Asked Questions (FAQs)

  • STMicroelectronics provides a recommended PCB layout in the application note AN5323, which includes guidelines for component placement, routing, and thermal management.
  • The VND830SP-E requires a 3.3V power supply, and it's recommended to use a low-dropout linear regulator (LDO) to ensure a stable voltage supply. Additionally, decoupling capacitors should be placed close to the device to filter out noise and ensure stable operation.
  • The maximum current rating for the VND830SP-E is 1.5A, but it's recommended to limit the current to 1A for reliable operation and to prevent overheating.
  • The VND830SP-E can be configured for half-bridge or full-bridge operation by connecting the appropriate pins and setting the enable pins (EN1 and EN2) accordingly. Refer to the datasheet and application notes for specific configuration details.
  • The VND830SP-E has a thermal pad that should be connected to a heat sink or a thermal interface material to dissipate heat. A thermal management strategy should be implemented to keep the junction temperature below 150°C to ensure reliable operation.

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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