VO2631 footprint, schematic symbol and 3D model by Vishay

Symbol

PCB Footprints

3D Models

VO2631 Details

A thermal pad on the bottom of the package is recommended for optimal thermal performance. A minimum of 2 oz copper thickness and a thermal relief pattern around the thermal pad is recommended.
Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Also, ensure that the device is properly mounted on a heat sink or a thermal interface material to dissipate heat efficiently.
The maximum allowable voltage stress on the device is 1.5 times the maximum rated voltage (VR) for a duration of less than 10 seconds. Prolonged exposure to high voltage stress can lead to device degradation.
Handle the device with ESD-protective equipment and follow proper ESD-handling procedures. Use an ESD-protective wrist strap or mat, and ensure that the device is stored in an ESD-protective package.
The recommended soldering profile is a peak temperature of 260°C for 10-30 seconds, with a ramp-up rate of 3°C/s and a ramp-down rate of 6°C/s. Ensure that the device is not exposed to temperatures above 260°C for more than 10 seconds.

Community Provided

System Verified

Community Approved

Use the download button to access the VO2631 schematic symbol, PCB footprint, and 3D model.

To find more CAD model downloads similar to this part, try a partial part number search, like VO263, or try a keyword search, such as Optocoupler

If you searched for VO2631, you might also be interested in these parts:

Showing 0 results


Please enter a minimum 3 letters or numbers
← Prev Next →