Part Image

VO3120-X007T - Vishay

Description: Logic Output Optocouplers 2.5A Current Out IGBT/MOSFET Drvr

Download VO3120-X007T Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
VO3120-X007T - Vishay PCB footprint - Small Outline Packages - Small Outline Packages - smd-6 option 7
click to zoom
3D Models
VO3120-X007T - Vishay  - 3D model - Small Outline Packages - smd-6 option 7
click to zoom

VO3120-X007T Details

  • Manufacturer Part Number:

    VO3120-X007T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMD-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    8.1

  • High Side Driver:

    NO

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    9.77 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    110 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    2.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.6 mm

  • Supply Voltage-Max:

    32 V

  • Supply Voltage-Min:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.4 µs

  • Turn-on Time:

    0.4 µs

  • Width:

    7.62 mm

VO3120-X007T Frequently Asked Questions (FAQs)

  • The recommended storage condition for VO3120-X007T is in a dry, cool place, away from direct sunlight, and in its original packaging or anti-static bag to prevent electrostatic discharge (ESD) damage.
  • Handle VO3120-X007T by the body, avoiding touching the leads or pins to prevent ESD damage. Use a soldering iron with a temperature below 260°C (500°F) and avoid applying excessive force or bending the leads during soldering.
  • The maximum allowable power dissipation for VO3120-X007T is 250 mW. Exceeding this limit may cause the device to overheat, leading to reduced performance or failure.
  • VO3120-X007T is rated for operation up to 125°C (257°F). However, it's essential to derate the power dissipation according to the temperature derating curve provided in the datasheet to ensure reliable operation.
  • To ensure reliability in humid environments, use conformal coating or potting to protect VO3120-X007T from moisture. Additionally, follow the recommended storage and handling procedures to prevent moisture absorption.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

VO3120-X007T Overview

Use the download button to access the VO3120-X007T schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like VO312, or try a keyword search, such as MOSFET Drivers

Parts related to VO3120-X007T

Showing 0 results