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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for VS-40HFR160
- Part Number VS-40HFR160
- Manufacturer Vishay
- Pin Count 1
- Part Category Diode
- Last Modified Date Jul 28, 2024 2:27 PM UTC
- Pinout / Pin List Click Here (Member Only)
VS-40HFR160 Details
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Manufacturer Part Number:
VS-40HFR160
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
DO-5, 1 PIN
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ECCN Code:
EAR99
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HTS Code:
8541.10.00.80
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Factory Lead Time:
9 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
5.07
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Application:
GENERAL PURPOSE
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Case Connection:
ANODE
VS-40HFR160 Frequently Asked Questions (FAQs)
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The recommended PCB footprint for the VS-40HFR160 is a rectangular pad with dimensions of 4.5 mm x 2.5 mm, with a 1.5 mm x 1.5 mm thermal pad in the center. The pad should have a solder mask defined (SMD) and a non-solder mask defined (NSMD) thermal pad.
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To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 217°C to 221°C. Apply a small amount of solder paste to the PCB pads, and use a reflow oven or a hot air soldering station to solder the component.
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The maximum allowed voltage derating for the VS-40HFR160 is 80% of the maximum rated voltage. For example, if the maximum rated voltage is 160 V, the derated voltage should not exceed 128 V.
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The power dissipation of the VS-40HFR160 can be calculated using the formula: Pd = (Vd x Id) / (RthJA x (Tj - Ta)), where Pd is the power dissipation, Vd is the voltage drop, Id is the current, RthJA is the thermal resistance, Tj is the junction temperature, and Ta is the ambient temperature.
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The recommended storage condition for the VS-40HFR160 is in a dry, cool place with a temperature range of 5°C to 30°C and a relative humidity of 60% or less. The components should be stored in their original packaging or in a sealed bag to prevent moisture absorption.
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VS-40HFR160 Overview
Use the download button to access the VS-40HFR160 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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