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VS-60CPU04-N3 - Vishay

Description: Vishay VS-60CPU04-N3, Dual Diode, Common Cathode, 400V 30A, 65ns, 3-Pin TO-247AC

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PCB Footprints
VS-60CPU04-N3 - Vishay PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247AD 3L
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3D Models
VS-60CPU04-N3 - Vishay  - 3D model - Transistor Outline, Vertical - TO-247AD 3L
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VS-60CPU04-N3 Details

  • Manufacturer Part Number:

    VS-60CPU04-N3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, PLASTIC PACKAGE-3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5.87

  • Additional Feature:

    FREE WHEELING DIODE, LOW LEAKAGE CURRENT

  • Application:

    ULTRA FAST RECOVERY

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.6 V

  • JEDEC-95 Code:

    TO-247AC

  • JESD-30 Code:

    R-PSFM-T3

  • Non-rep Pk Forward Current-Max:

    300 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    30 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    400 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    0.04 µs

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

VS-60CPU04-N3 Frequently Asked Questions (FAQs)

  • The recommended PCB layout involves keeping the component away from heat sources, using a solid ground plane, and ensuring good thermal conductivity. Thermal management involves using a heat sink or thermal interface material to keep the junction temperature below 150°C.
  • To ensure reliability and longevity, follow proper storage and handling procedures, use a clean and dry environment, and avoid exceeding the recommended operating conditions. Additionally, consider using a conformal coating and following a robust design verification process.
  • The VS-60CPU04-N3 is sensitive to electrostatic discharge (ESD). Handle the component in an ESD-protected environment, use ESD-protective packaging, and follow proper grounding procedures to prevent damage.
  • While the VS-60CPU04-N3 is designed to be rugged, it's essential to evaluate the component's performance in your specific high-vibration or high-shock environment. Consider using additional mechanical support or vibration isolation to ensure reliable operation.
  • Operating the VS-60CPU04-N3 at high temperatures can affect its performance, reliability, and lifespan. Ensure that the component is operated within the recommended temperature range (−40°C to 150°C) to prevent degradation or failure.

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VS-60CPU04-N3 Overview

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