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VS-E5PX3012LHN3 - Vishay

Description: Fast / Ultrafast Diode, 1.2 kV, 30 A, Single, 3.3 V, 80 ns, 190 A

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Symbol
VS-E5PX3012LHN3 - Vishay - PCB symbol
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PCB Footprints
VS-E5PX3012LHN3 - Vishay PCB footprint - Other - Other - TO-247AD 2L_2024
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3D Models
VS-E5PX3012LHN3 - Vishay - 3D model - Other - TO-247AD 2L_2024
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VS-E5PX3012LHN3 Details

  • Manufacturer Part Number:

    VS-E5PX3012LHN3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    10 Weeks

  • Date Of Intro:

    2020-10-18

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5.95

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    1200 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    3.3 V

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T2

  • Non-rep Pk Forward Current-Max:

    190 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    30 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    1200 V

  • Reverse Current-Max:

    50 µA

  • Reverse Recovery Time-Max:

    0.1 µs

  • Reverse Test Voltage:

    1200 V

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

VS-E5PX3012LHN3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the VS-E5PX3012LHN3 is a rectangle with dimensions of 5.08 mm x 3.05 mm, with a thermal pad size of 2.5 mm x 2.5 mm. It's essential to follow the recommended footprint to ensure proper thermal performance and to prevent overheating.
  • Yes, the VS-E5PX3012LHN3 is suitable for high-reliability applications. It's built with a robust design and undergoes rigorous testing to ensure its performance and longevity. However, it's crucial to follow proper design and assembly guidelines to ensure the component's reliability.
  • Proper thermal management is crucial for the VS-E5PX3012LHN3. Ensure good thermal conductivity by using a thermal interface material (TIM) between the component and the heat sink. Also, design the PCB to allow for good airflow and consider using a heat sink with a thermal resistance of less than 10°C/W.
  • Yes, the VS-E5PX3012LHN3 is compatible with lead-free soldering processes. It's designed to withstand the higher temperatures associated with lead-free soldering, and its package is constructed to minimize the risk of solder joint failures.
  • The maximum operating temperature range for the VS-E5PX3012LHN3 is -55°C to 175°C. However, it's essential to note that the component's performance and reliability may degrade at extreme temperatures. Always follow the recommended operating conditions to ensure optimal performance.

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VS-E5PX3012LHN3 Overview

Use the download button to access the VS-E5PX3012LHN3 schematic symbol, PCB footprint, and 3D model.
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