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VS-HFA04SD60STRHM3 - Vishay

Description: Diodes - General Purpose, Power, Switching 4 Amp 600 Volt

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PCB Footprints
VS-HFA04SD60STRHM3 - Vishay PCB footprint - Other - Other - D-PAK (TO-252AA) “M”_FFW
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3D Models
VS-HFA04SD60STRHM3 - Vishay  - 3D model - Other - D-PAK (TO-252AA) “M”_FFW
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VS-HFA04SD60STRHM3 Details

  • Manufacturer Part Number:

    VS-HFA04SD60STRHM3

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DPAK-3/2

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6

  • Additional Feature:

    FREE WHEELING DIODE, PD-CASE

  • Application:

    ULTRA FAST SOFT RECOVERY

  • Breakdown Voltage-Min:

    600 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    2.2 V

  • JEDEC-95 Code:

    TO-252AA

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    25 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    10 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    3 µA

  • Reverse Recovery Time-Max:

    0.042 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

VS-HFA04SD60STRHM3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the VS-HFA04SD60STRHM3 is a standard SMD pad layout with a minimum pad size of 1.5 mm x 1.5 mm and a maximum pad size of 2.5 mm x 2.5 mm, with a 1.27 mm pitch.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 217°C to 220°C. Apply a small amount of solder paste to the PCB pads, and use a reflow oven or a hot air gun to solder the component.
  • The maximum operating temperature range for the VS-HFA04SD60STRHM3 is -55°C to 150°C, with a derating of 1.33 mΩ/°C above 25°C.
  • Yes, the VS-HFA04SD60STRHM3 is suitable for high-frequency applications up to 1 GHz, but it's essential to consider the component's parasitic inductance and capacitance, as well as the PCB layout and design, to minimize signal degradation and ensure optimal performance.
  • Store the VS-HFA04SD60STRHM3 in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging materials, such as ESD bags or tubes, to prevent damage from electrostatic discharge. Avoid bending or flexing the component during handling and shipping.

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VS-HFA04SD60STRHM3 Overview

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Part Image VS-HFA04SD60STRLHM3 Vishay Intertechnologies

Rectifier Diode, 1 Phase, 1 Element, 4A, 600V V(RRM), Silicon, TO-252AA

Part Image VS-HFA04SD60STRRHM3 Vishay Intertechnologies

Rectifier Diode, 1 Phase, 1 Element, 4A, 600V V(RRM), Silicon, TO-252AA