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VS-HFA30PA60C-N3 - Vishay

Description: Vishay 600V 30A, Dual Diode, 3-Pin TO-247AC HFA30PA60CPBF

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Symbol
VS-HFA30PA60C-N3 - Vishay - PCB symbol
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PCB Footprints
VS-HFA30PA60C-N3 - Vishay PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247AC - 50 mils L/F
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3D Models
VS-HFA30PA60C-N3 - Vishay - 3D model - Transistor Outline, Vertical - TO-247AC - 50 mils L/F
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VS-HFA30PA60C-N3 Details

  • Manufacturer Part Number:

    VS-HFA30PA60C-N3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, PLASTIC PACKAGE-3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6

  • Additional Feature:

    LOW NOISE, PD-CASE

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    2 V

  • JEDEC-95 Code:

    TO-247AC

  • JESD-30 Code:

    R-PSFM-T3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    150 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Power Dissipation-Max:

    74 W

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    0.06 µs

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

VS-HFA30PA60C-N3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the VS-HFA30PA60C-N3 is a pad size of 1.5 mm x 1.5 mm with a 0.5 mm spacing between pads. However, it's recommended to consult the datasheet and application notes for specific guidelines.
  • To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Avoid applying excessive heat or pressure, which can damage the component.
  • The maximum operating temperature range for the VS-HFA30PA60C-N3 is -55°C to 175°C. However, it's recommended to operate the device within the specified temperature range to ensure optimal performance and reliability.
  • Yes, the VS-HFA30PA60C-N3 is suitable for high-reliability applications. It's built with a robust design and undergoes rigorous testing to ensure its performance and reliability in demanding environments.
  • Handle the VS-HFA30PA60C-N3 by the body, avoiding touching the leads or electrical contacts. Store the device in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and follow proper ESD handling procedures to prevent damage.

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VS-HFA30PA60C-N3 Overview

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