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VS-HFA30PB120HN3 - Vishay

Description: Rectifiers 30 Amp 1200 Volt

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VS-HFA30PB120HN3 - Vishay PCB footprint - Other - Other - VS-HFA30PB120HN3-5
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VS-HFA30PB120HN3 - Vishay  - 3D model - Other - VS-HFA30PB120HN3-5
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VS-HFA30PB120HN3 Details

  • Manufacturer Part Number:

    VS-HFA30PB120HN3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MODIFIED TO-247AC, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5.95

  • Additional Feature:

    LOW NOISE, PD-CASE

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    5.7 V

  • JESD-30 Code:

    R-PSFM-T2

  • Non-rep Pk Forward Current-Max:

    120 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    30 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    350 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    1200 V

  • Reverse Current-Max:

    40 µA

  • Reverse Recovery Time-Max:

    0.17 µs

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

VS-HFA30PB120HN3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the VS-HFA30PB120HN3 is a rectangular pad with dimensions of 3.3 mm x 2.5 mm, with a 1.3 mm x 1.3 mm thermal pad in the center. The pad should have a solder mask defined (SMD) and a non-solder mask defined (NSMD) thermal pad.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 217°C to 221°C. Apply a small amount of solder paste to the PCB pad, and use a reflow oven or a hot air gun to solder the component. Avoid using excessive solder or flux, as it can cause shorts or damage to the component.
  • The maximum allowed voltage derating for the VS-HFA30PB120HN3 is 80% of the rated voltage, which is 96 V. This means that the maximum allowed voltage is 96 V x 0.8 = 76.8 V.
  • The power dissipation of the VS-HFA30PB120HN3 can be calculated using the formula: Pd = (Vds x Ids) + (Vgs x Igs), where Pd is the power dissipation, Vds is the drain-to-source voltage, Ids is the drain-to-source current, Vgs is the gate-to-source voltage, and Igs is the gate-to-source current. The maximum power dissipation is 30 W.
  • The thermal resistance of the VS-HFA30PB120HN3 is RthJA = 40°C/W (junction-to-ambient) and RthJC = 2.5°C/W (junction-to-case). This means that for every 1 W of power dissipation, the junction temperature will increase by 40°C (RthJA) or 2.5°C (RthJC).

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VS-HFA30PB120HN3 Overview

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