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VS12VBA1HST15R - ROHM Semiconductor

Description: RASMID™ Series - Transient Voltage Suppressor

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PCB Footprints
VS12VBA1HST15R - ROHM Semiconductor PCB footprint - Other - Other - (DSN0603-2 SOD962 SMD0603B)
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3D Models
VS12VBA1HST15R - ROHM Semiconductor  - 3D model - Other - (DSN0603-2 SOD962 SMD0603B)
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VS12VBA1HST15R Details

  • Manufacturer Part Number:

    VS12VBA1HST15R

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DSN0603, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Date Of Intro:

    2018-03-16

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.46

  • Additional Feature:

    HIGH RELIABILITY

  • Breakdown Voltage-Max:

    15 V

  • Breakdown Voltage-Min:

    12.5 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-XBCC-N2

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    70 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    0.1 W

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    12 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

VS12VBA1HST15R Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area on the top and bottom layers connected to the thermal pad, and to use thermal vias to dissipate heat. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the maximum power dissipation according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal design and heat sinking to keep the junction temperature below the maximum rating.
  • The recommended soldering profile for VS12VBA1HST15R is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 220°C. A soldering iron temperature of 350°C is recommended.
  • To handle ESD protection for VS12VBA1HST15R, it is recommended to use an ESD wrist strap or mat, and to handle the component by the body or leads, avoiding direct contact with the die. ESD-sensitive devices should be stored in anti-static packaging.
  • The recommended storage condition for VS12VBA1HST15R is in a dry, cool place, away from direct sunlight and moisture. The component should be stored in its original packaging or in a similar anti-static packaging.

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VS12VBA1HST15R Overview

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