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VSB2045-M3/73 - Vishay

Description: Diode Schottky 45V 20A Solar Cell P600 Vishay VSB2045-M3/73, Schottky Diode, 45V 20A, 10ns, 2-Pin P600

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PCB Footprints
VSB2045-M3/73 - Vishay PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - Diode P600 Package
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VSB2045-M3/73 - Vishay  - 3D model - Diodes, Axial Diameter Horizontal Mounting - Diode P600 Package
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VSB2045-M3/73 Details

  • Manufacturer Part Number:

    VSB2045-M3/73

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, CASE P600, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Additional Feature:

    LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.5 V

  • JESD-30 Code:

    O-PALF-W2

  • Non-rep Pk Forward Current-Max:

    250 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    200 °C

  • Output Current-Max:

    6.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    45 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

VSB2045-M3/73 Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves using a thermal pad with a minimum size of 2.5 mm x 2.5 mm, and a thermal via array with a minimum of 5 vias, 0.5 mm in diameter, spaced 1.5 mm apart. This layout helps to reduce thermal resistance and ensures efficient heat dissipation.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 217°C to 220°C. Apply a small amount of solder paste to the thermal pad and reflow according to the recommended soldering profile. Avoid using excessive solder or flux, as this can lead to poor joint reliability.
  • The maximum allowed voltage derating for the VSB2045-M3/73 is 80% of the maximum rated voltage. This means that if the maximum rated voltage is 45 V, the maximum allowed voltage derating would be 36 V. Exceeding this derating may lead to reduced reliability or even device failure.
  • To handle ESD protection for the VSB2045-M3/73, ensure that all handling and assembly procedures follow ESD-safe practices. Use ESD-protective packaging, wrist straps, and mats, and avoid touching the device's pins or exposed thermal pad. If ESD damage is suspected, perform a thorough visual inspection and functional testing before installing the device.
  • Store the VSB2045-M3/73 in its original packaging, away from direct sunlight, moisture, and extreme temperatures. Handle the device by the body, avoiding touching the pins or thermal pad. Avoid bending or flexing the leads, and ensure that the device is not subjected to mechanical stress or vibration during storage or transportation.

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VSB2045-M3/73 Overview

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