CUI recommends a PCB layout with a solid ground plane and thermal vias to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, a thermal interface material (TIM) with a thermal conductivity of 1-2 W/m-K should be used between the module and the heat sink.
To ensure reliable start-up and shutdown, CUI recommends a soft-start circuit to limit inrush current and a shutdown circuit to prevent voltage spikes. Additionally, a minimum of 10ms delay between power-on and enable signals is recommended.
CUI provides derating curves for temperature and altitude in the application notes section of the datasheet. For temperature, the output power derates by 2.5% per degree Celsius above 40°C. For altitude, the output power derates by 1% per 1,000 feet above sea level.
Yes, the VSK-S25-5U can be used in a redundant configuration. CUI recommends using a diode ORing circuit to connect the outputs of multiple modules. Additionally, a synchronization signal can be used to ensure that the modules are in phase with each other.
CUI estimates the MTBF of the VSK-S25-5U to be approximately 1.5 million hours at 40°C, calculated according to MIL-HDBK-217F.
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