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VX7803-500 - CUI Inc.

Description: Non-Isolated DC/DC Converters 4.75-36Vin 3.3V 0.5A 1.65W SIP non-Iso

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PCB Footprints
VX7803-500 - CUI Inc. PCB footprint - Other - Other - VX7803-500-3
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3D Models
VX7803-500 - CUI Inc.  - 3D model - Other - VX7803-500-3
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VX7803-500 Details

  • Manufacturer Part Number:

    VX7803-500

  • Brand Name:

    CUI Inc

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    SIP-3

  • ECCN Code:

    EAR99

  • Manufacturer:

    CUI Inc

  • YTEOL:

    3

  • Analog IC - Other Type:

    DC-DC REGULATED POWER SUPPLY MODULE

  • Approvals:

    CIS, EN, IEC, UL

  • Efficiency (Main Output):

    86%

  • Input Voltage-Max:

    36 V

  • Input Voltage-Min:

    4.75 V

  • Input Voltage-Nom:

    24 V

  • JESD-30 Code:

    R-PSIP-T3

  • Length:

    11.6 mm

  • Line Regulation-Max:

    0.4%

  • Load Regulation-Max:

    0.6%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.5 A

  • Output Voltage-Max:

    3.432 V

  • Output Voltage-Min:

    3.168 V

  • Output Voltage-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SIP

  • Package Equivalence Code:

    SIP3,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Protections:

    SHORT CIRCUIT

  • Ripple Voltage (Main Out):

    0.0265125 Vrms

  • Seated Height-Max:

    10.41 mm

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Total Power Output-Max:

    2.5 W

  • Trim/Adjustable Output:

    NO

  • Width:

    7.55 mm

VX7803-500 Frequently Asked Questions (FAQs)

  • CUI recommends a 4-layer PCB with a solid ground plane, and thermal vias under the module to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the module and the PCB.
  • To ensure EMC, use a shielded enclosure, keep the module away from sensitive circuits, and use a common-mode choke or ferrite bead on the input lines. Additionally, follow proper PCB layout and grounding practices.
  • The maximum allowable capacitance on the output is 2200uF. Exceeding this value may cause instability or oscillation in the converter.
  • Yes, the VX7803-500 can be used in a redundant or parallel configuration, but it requires additional external circuitry and careful design consideration to ensure proper operation and fault tolerance.
  • Check the input voltage, output load, and PCB layout for any issues. Verify that the module is properly soldered and that the thermal interface is adequate. Consult the datasheet and application notes for troubleshooting guides and contact CUI support if necessary.

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VX7803-500 Overview

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