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W2465S-70LL - Winbond

Description: 8K ´ 8 CMOS STATIC RAM Active: 250 mW (max. Single +5V power supply

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PCB Footprints
W2465S-70LL - Winbond PCB footprint - Small Outline Packages - Small Outline Packages - 28-pin SO_2024
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3D Models
W2465S-70LL - Winbond  - 3D model - Small Outline Packages - 28-pin SO_2024
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W2465S-70LL Details

  • Manufacturer Part Number:

    W2465S-70LL

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    0.330 INCH, SOP-28

  • Pin Count:

    28

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    0

  • Access Time-Max:

    70 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e0

  • Length:

    18.11 mm

  • Memory Density:

    65536 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    28

  • Number of Words:

    8192 words

  • Number of Words Code:

    8000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    8KX8

  • Output Characteristics:

    3-STATE

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP28,.45

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    PARALLEL

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.85 mm

  • Standby Current-Max:

    0.00001 A

  • Standby Voltage-Min:

    2 V

  • Supply Current-Max:

    0.07 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    8.41 mm

W2465S-70LL Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the W2465S-70LL involves placing the chip near the center of the board, using a solid ground plane, and keeping signal traces short and away from noise sources. Additionally, it's recommended to use a 4-layer board with a dedicated power plane and a dedicated ground plane.
  • The W2465S-70LL has an internal POR and BOD circuitry. To handle these features, ensure that the power supply is stable and within the recommended voltage range. Also, use an external capacitor (typically 10nF to 100nF) between the VCC and GND pins to filter out noise and ensure proper POR and BOD operation.
  • The maximum operating frequency of the W2465S-70LL is 70 MHz. As the operating frequency increases, power consumption also increases. To minimize power consumption, operate the device at the lowest frequency required for your application, and use the power-down mode when the device is not in use.
  • To implement a reliable boot process, ensure that the boot loader is stored in a non-volatile memory (e.g., flash memory) and that the boot process is designed to handle power-on reset and brown-out detection. Also, use a watchdog timer to detect and recover from system failures.
  • To minimize EMI and ensure EMC, use a shielded enclosure, keep signal traces short and away from noise sources, and use a common-mode choke or ferrite bead on the power supply lines. Additionally, ensure that the PCB layout and component placement are designed to minimize radiation and susceptibility to external interference.

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