Part Image

W25M02GVTBIG - Winbond

Description: Multichip Packages 2G-bit Serial NAND flash, 3V

Download W25M02GVTBIG Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
W25M02GVTBIG - Winbond PCB footprint - BGA - BGA - TFBGA24 Ball (6x8 mm2 (5x5-1 ball arrays), Ball pitch: 1.00mm, Ø =0.40mm)
click to zoom
3D Models
W25M02GVTBIG - Winbond  - 3D model - BGA - TFBGA24 Ball (6x8 mm2 (5x5-1 ball arrays), Ball pitch: 1.00mm, Ø =0.40mm)
click to zoom

W25M02GVTBIG Details

  • Manufacturer Part Number:

    W25M02GVTBIG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    0

  • Clock Frequency-Max (fCLK):

    104 MHz

  • JESD-30 Code:

    R-PBGA-B24

  • Length:

    8 mm

  • Memory Density:

    2147483648 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of Words:

    268435456 words

  • Number of Words Code:

    256000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Programming Voltage:

    3 V

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Type:

    SLC NAND TYPE

  • Width:

    6 mm

W25M02GVTBIG Frequently Asked Questions (FAQs)

  • The W25M02GVTBIG has a minimum of 100,000 erase cycles, but the actual number of cycles may vary depending on the usage and operating conditions.
  • The hold pin (HOLD#) is an active low input that allows the device to be paused during a write or erase operation. To use it, connect it to a logic low signal to pause the operation, and connect it to a logic high signal to resume the operation.
  • The WP# pin is a write protect pin that allows the device to be write-protected. To use it, connect it to a logic low signal to enable write protection, and connect it to a logic high signal to disable write protection.
  • The optimal clock frequency depends on the specific application and system requirements. The W25M02GVTBIG supports clock frequencies up to 104 MHz, but you may need to adjust the frequency based on your system's timing constraints and noise tolerance.
  • The W25M02GVTBIG is a specific device with a unique set of features, such as its 2Gb density, 3.3V operating voltage, and SPI interface. Other similar devices from Winbond may have different densities, operating voltages, or interfaces, so be sure to check the datasheet for specific details.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

W25M02GVTBIG Overview

Use the download button to access the W25M02GVTBIG schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like W25M0, or try a keyword search, such as Flash Memories

Parts related to W25M02GVTBIG

Showing 0 results