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W25M02GVTBIT - Winbond

Description: Multichip Packages 2G-bit Serial NAND flash, 3V

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PCB Footprints
W25M02GVTBIT - Winbond PCB footprint - BGA - BGA - 24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 Ball Array)
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3D Models
W25M02GVTBIT - Winbond  - 3D model - BGA - 24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 Ball Array)
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W25M02GVTBIT Details

  • Manufacturer Part Number:

    W25M02GVTBIT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    0

  • Clock Frequency-Max (fCLK):

    104 MHz

  • JESD-30 Code:

    R-PBGA-B24

  • Length:

    8 mm

  • Memory Density:

    2147483648 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of Words:

    268435456 words

  • Number of Words Code:

    256000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Programming Voltage:

    3 V

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Type:

    SLC NAND TYPE

  • Width:

    6 mm

W25M02GVTBIT Frequently Asked Questions (FAQs)

  • The W25M02GVTBIT has a minimum of 100,000 erase cycles per sector, and a total of 1,000,000 erase cycles for the entire device.
  • The HOLD# pin should be pulled high during power-up and power-down to prevent any unwanted commands from being executed. It's recommended to connect a pull-up resistor to VCC and a capacitor to GND to ensure a clean power-up and power-down sequence.
  • The W25M02GVTBIT supports clock frequencies up to 104 MHz. However, it's recommended to use a clock frequency of 50 MHz or lower to ensure reliable operation and to minimize power consumption.
  • The WP# pin should be pulled high during normal operation to enable write operations. If the WP# pin is pulled low, the device will be in a write-protected state, and any write operations will be ignored.
  • The deep power-down mode is used to reduce power consumption to a minimum when the device is not in use. In this mode, the device will consume less than 1 μA of current. However, the device will take longer to wake up from deep power-down mode compared to normal standby mode.

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