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W25M512JWCAQ - Winbond

Description:  New Family of SpiFlash® Memories – W25M512JV: 2 x 256M-bit (2 x 32M-Byte) – Standard SPI: CLK, /CS, DI, DO – Dual SPI: CLK, /CS, IO0, IO1 – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – 3 or 4-Byte Addressing Mode – Software Die Select (C2h) – Software & Hardware Reset(1)  High Performance Serial Flash – 104MHz Standard/Dual/Quad SPI clocks – 208/416MHz equivalent Dual/Quad SPI – 50MB/s continuous data transfer rate – Min. 100K Program-Erase cycles per sector – More than 20-year data retention

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PCB Footprints
W25M512JWCAQ - Winbond PCB footprint - BGA - BGA - 24-Ball TFBGA 8x6-mm (Package Code C, 6x4 Ball Array)
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3D Models
W25M512JWCAQ - Winbond  - 3D model - BGA - 24-Ball TFBGA 8x6-mm (Package Code C, 6x4 Ball Array)
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W25M512JWCAQ Details

  • Manufacturer Part Number:

    W25M512JWCAQ

  • Manufacturer:

    Winbond Electronics Corp

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