W25N01JWTBIG - Winbond

W25N01JWTBIG Details

• Manufacturer Part Number:

  W25N01JWTBIG

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  TFBGA-24

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.51

• Manufacturer:

  Winbond Electronics Corp

• YTEOL:

  6.15

• Clock Frequency-Max (fCLK):

  166 MHz

• Data Retention Time-Min:

  10

• Endurance:

  100000 Write/Erase Cycles

• JESD-30 Code:

  R-PBGA-B24

• Length:

  8 mm

• Memory Density:

  1073741824 bit

• Memory IC Type:

  FLASH

• Memory Width:

  8

• Number of Functions:

  1

• Number of Terminals:

  24

• Number of Words:

  134217728 words

• Number of Words Code:

  128000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  128MX8

• Output Characteristics:

  3-STATE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TBGA

• Package Equivalence Code:

  BGA24,5X5,40

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, THIN PROFILE

• Parallel/Serial:

  SERIAL

• Peak Reflow Temperature (Cel):

  NOT SPECIFIED

• Programming Voltage:

  1.8 V

• Seated Height-Max:

  1.2 mm

• Serial Bus Type:

  QSPI

• Standby Current-Max:

  0.00015 A

• Supply Current-Max:

  0.035 mA

• Supply Voltage-Max (Vsup):

  1.95 V

• Supply Voltage-Min (Vsup):

  1.7 V

• Supply Voltage-Nom (Vsup):

  1.8 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  NOT SPECIFIED

• Type:

  SLC NAND TYPE

• Width:

  6 mm

• Write Protection:

  HARDWARE/SOFTWARE