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W25N01JWZEIG - Winbond

Description: New W25N Family of SpiFlash Memories – W25N01JW: 1G-bit / 128M-Byte – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold, – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – Compatible SPI Serial Flash commands  Highest Performance Serial NAND Flash – 166MHz Standard/Dual/Quad SPI clocks – 332/664MHz equivalent Dual/Quad SPI – DTR (Dual Transfer Rate) up to 80MHz – 80MB/s continuous data transfer rate – Fast Program/Erase performance – More than 100,000 erase/program c

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PCB Footprints
W25N01JWZEIG - Winbond PCB footprint - Small Outline No-lead - Small Outline No-lead - 11.2 8-Pad WSON 8x6-mm (Package Code ZE).
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3D Models
W25N01JWZEIG - Winbond  - 3D model - Small Outline No-lead - 11.2 8-Pad WSON 8x6-mm (Package Code ZE).
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W25N01JWZEIG Details

  • Manufacturer Part Number:

    W25N01JWZEIG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WSON-8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    6

  • Clock Frequency-Max (fCLK):

    166 MHz

  • Data Retention Time-Min:

    10

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-XDSO-N8

  • Length:

    8 mm

  • Memory Density:

    1073741824 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    134217728 words

  • Number of Words Code:

    128000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    1.8 V

  • Seated Height-Max:

    0.8 mm

  • Serial Bus Type:

    QSPI

  • Standby Current-Max:

    0.00015 A

  • Supply Current-Max:

    0.035 mA

  • Supply Voltage-Max (Vsup):

    1.95 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Type:

    SLC NAND TYPE

  • Width:

    6 mm

  • Write Protection:

    HARDWARE/SOFTWARE

W25N01JWZEIG Frequently Asked Questions (FAQs)

  • The W25N01JWZEIG supports up to 100,000 erase cycles.
  • The hold pin (HOLD#) is used to pause the flash memory operation. To use it, pull the HOLD# pin low to pause the operation, and pull it high to resume the operation.
  • The WP# pin is the write protect pin. When pulled low, it prevents writing to the status register and the memory array. To use it, pull the WP# pin low to enable write protection, and pull it high to disable write protection.
  • The optimal clock frequency depends on the specific application and system requirements. The W25N01JWZEIG supports clock frequencies up to 104 MHz. You should consult the datasheet and application notes to determine the optimal clock frequency for your specific use case.
  • The W25N01JWZEIG has an active current of 15 mA (typical) and a standby current of 10 μA (typical). The power consumption characteristics are dependent on the operating frequency, voltage, and other factors. Consult the datasheet for more information.

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W25N01JWZEIG Overview

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