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W25N01JWZEIT - Winbond

Description:  New W25N Family of SpiFlash Memories – W25N01JW: 1G-bit / 128M-Byte – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold, – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – Compatible SPI Serial Flash commands  Highest Performance Serial NAND Flash – 166MHz Standard/Dual/Quad SPI clocks – 332/664MHz equivalent Dual/Quad SPI – DTR (Dual Transfer Rate) up to 80MHz – 80MB/s continuous data transfer rate – Fast Program/Erase performance – More than 100,000 erase/program

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PCB Footprints
W25N01JWZEIT - Winbond PCB footprint - Small Outline No-lead - Small Outline No-lead - 11.2 8-Pad WSON 8x6-mm (Package Code ZE).
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3D Models
W25N01JWZEIT - Winbond  - 3D model - Small Outline No-lead - 11.2 8-Pad WSON 8x6-mm (Package Code ZE).
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W25N01JWZEIT Details

  • Manufacturer Part Number:

    W25N01JWZEIT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WSON-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    6.45

  • Clock Frequency-Max (fCLK):

    166 MHz

  • Data Retention Time-Min:

    10

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-XDSO-N8

  • Length:

    8 mm

  • Memory Density:

    1073741824 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    134217728 words

  • Number of Words Code:

    128000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    1.8 V

  • Seated Height-Max:

    0.8 mm

  • Serial Bus Type:

    QSPI

  • Standby Current-Max:

    0.00015 A

  • Supply Current-Max:

    0.035 mA

  • Supply Voltage-Max (Vsup):

    1.95 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Type:

    SLC NAND TYPE

  • Width:

    6 mm

  • Write Protection:

    HARDWARE/SOFTWARE

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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W25N01JWZEIT Overview

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