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W25N02KVTBIR - Winbond

Description:  New W25N Family of QspiNAND Memories – W25N02KV: 2G-bit / 256M-Byte – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – Compatible SPI serial flash commands  Highest Performance Serial NAND Flash – 104MHz Standard/Dual/Quad SPI clocks – 208/416MHz equivalent Dual/Quad SPI – 50MB/S sequential data transfer rate – Fast Program/Erase performance – 60,000 erase/program cycles – 10-year data retention  Low Power, Wi

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PCB Footprints
W25N02KVTBIR - Winbond PCB footprint - BGA - BGA - 11.3 24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 Ball Array)-*
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3D Models
W25N02KVTBIR - Winbond  - 3D model - BGA - 11.3 24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 Ball Array)-*
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W25N02KVTBIR Details

  • Manufacturer Part Number:

    W25N02KVTBIR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    6.1

  • Clock Frequency-Max (fCLK):

    104 MHz

  • Data Retention Time-Min:

    10

  • Endurance:

    60000 Write/Erase Cycles

  • JESD-30 Code:

    R-PBGA-B24

  • Length:

    8 mm

  • Memory Density:

    2147483648 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of Words:

    268435456 words

  • Number of Words Code:

    256000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA24,5X5,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3 V

  • Seated Height-Max:

    1.2 mm

  • Serial Bus Type:

    QSPI

  • Standby Current-Max:

    0.00005 A

  • Supply Current-Max:

    0.035 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Type:

    SLC NAND TYPE

  • Width:

    6 mm

  • Write Protection:

    HARDWARE/SOFTWARE

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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W25N02KVTBIR Overview

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