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W25Q01JVSFIN - Winbond

Description: – W25Q01JV: two 512M-bit / 128M-byte – Standard SPI: CLK, /CS, DI, DO – Dual SPI: CLK, /CS, IO0, IO1, – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – 3 or 4-Byte Addressing Mode

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W25Q01JVSFIN - Winbond PCB footprint - Small Outline Packages - Small Outline Packages - 16-Pin SOIC 300-mil (Package Code SF)*-
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W25Q01JVSFIN Details

  • Manufacturer Part Number:

    W25Q01JVSFIN

  • Manufacturer:

    Winbond Electronics Corp

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