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W25Q01JVTBIQ - Winbond

Description: 1G-bit Serial Flash Memory with uniform 4KB sectors and Dual/Quad SPI

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PCB Footprints
W25Q01JVTBIQ - Winbond PCB footprint - BGA - BGA - 24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 Ball Array)
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3D Models
W25Q01JVTBIQ - Winbond  - 3D model - BGA - 24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 Ball Array)
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W25Q01JVTBIQ Details

  • Manufacturer Part Number:

    W25Q01JVTBIQ

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TFBGA-24

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Date Of Intro:

    2019-11-20

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    6.15

  • Clock Frequency-Max (fCLK):

    133 MHz

  • Data Retention Time-Min:

    20

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PBGA-B24

  • Length:

    8 mm

  • Memory Density:

    1073741824 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of Words:

    134217728 words

  • Number of Words Code:

    128000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TBGA

  • Package Equivalence Code:

    BGA24,5X5,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Programming Voltage:

    3 V

  • Seated Height-Max:

    1.2 mm

  • Serial Bus Type:

    QSPI

  • Standby Current-Max:

    0.00004 A

  • Supply Current-Max:

    0.1 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Type:

    NOR TYPE

  • Width:

    6 mm

  • Write Protection:

    HARDWARE/SOFTWARE

W25Q01JVTBIQ Frequently Asked Questions (FAQs)

  • The W25Q01JVBTIQ has a minimum of 100,000 erase cycles, but the actual number of cycles may vary depending on usage and environmental conditions.
  • The HOLD# pin is used to pause the current operation and put the device in a low-power state. To use it, pull the HOLD# pin low to pause the operation, and pull it high to resume. Make sure to check the datasheet for specific timing requirements.
  • The WP# pin is the write protect pin. When pulled low, it prevents writing to the status register and the memory array. To use it, pull the WP# pin high to enable writing, and pull it low to disable writing.
  • The optimal clock frequency depends on the specific application and system requirements. The W25Q01JVBTIQ supports clock frequencies up to 104 MHz. Consult the datasheet for specific timing requirements and consider factors like power consumption, noise tolerance, and system latency when selecting a clock frequency.
  • The W25Q01JVBTIQ is a 1Gb (128MB) serial flash memory chip with a quad-SPI interface. It has a unique combination of features, such as a high-speed clock frequency, low power consumption, and a small package size. Compare the datasheet with other similar chips to determine the best fit for your specific application.

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W25Q01JVTBIQ Overview

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