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W25Q01NWSFIM - Winbond

Description: 1G-bit Serial Flash Memory with uniform 4KB sectors and Dual/Quad SPI

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PCB Footprints
W25Q01NWSFIM - Winbond PCB footprint - Small Outline Packages - Small Outline Packages - 16 PIN SOIC 300-MIL SF
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3D Models
W25Q01NWSFIM - Winbond  - 3D model - Small Outline Packages - 16 PIN SOIC 300-MIL SF
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W25Q01NWSFIM Details

  • Manufacturer Part Number:

    W25Q01NWSFIM

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Winbond Electronics Corp

  • Memory IC Type:

    FLASH

W25Q01NWSFIM Frequently Asked Questions (FAQs)

  • The W25Q01NWSFIM has a minimum of 100,000 erase cycles per sector, and a total of 1,000,000 erase cycles for the entire device.
  • The HOLD# pin should be pulled high during power-up and power-down to prevent any unwanted commands from being executed. It's recommended to connect a pull-up resistor to VCC.
  • The recommended clock frequency for the W25Q01NWSFIM is up to 104 MHz. However, it's recommended to check the specific application and system requirements for the optimal clock frequency.
  • The WP# pin is used to enable or disable write protection for the status register. When WP# is low, the status register is write-protected. When WP# is high, the status register can be written to. It's recommended to connect a pull-up resistor to VCC to enable write protection by default.
  • The main difference between the W25Q01NWSFIM and the W25Q01JVSSIM is the package type. The W25Q01NWSFIM is available in a SOP-8 package, while the W25Q01JVSSIM is available in a VSOP-8 package. Both devices have the same electrical characteristics and functionality.

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W25Q01NWSFIM Overview

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