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W25Q01NWSFIQ - Winbond

Description: FLASH - NOR Memory IC 1Gbit SPI - Quad I/O 133 MHz 7 ns 16-SOIC

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PCB Footprints
W25Q01NWSFIQ - Winbond PCB footprint - Small Outline Packages - Small Outline Packages - SOP - 16
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3D Models
W25Q01NWSFIQ - Winbond  - 3D model - Small Outline Packages - SOP - 16
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W25Q01NWSFIQ Details

  • Manufacturer Part Number:

    W25Q01NWSFIQ

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Winbond Electronics Corp

  • Memory IC Type:

    FLASH

W25Q01NWSFIQ Frequently Asked Questions (FAQs)

  • The W25Q01NWSFIQ has a minimum of 100,000 erase cycles per sector, and a total of 1,000,000 erase cycles for the entire device.
  • The HOLD# pin should be pulled high during power-up and power-down to prevent any unwanted commands from being executed. It's recommended to connect a pull-up resistor to VCC.
  • The recommended clock frequency for the SPI interface is up to 104 MHz, but it can operate at lower frequencies as well. The device can also operate in dual I/O and quad I/O modes at higher frequencies.
  • The device density and organization can be determined by reading the JEDEC ID (0xEF 0x40 0x01) and the device ID (0x01 0x02 0x03 0x04). The W25Q01NWSFIQ has a density of 1 Gbit and is organized as 128 Kbytes x 8 bits.
  • The WP# pin is used to enable or disable the write protection of the status register. When WP# is low, the status register is write-protected. When WP# is high, the status register can be written to. It's recommended to connect WP# to VCC or GND depending on the application requirements.

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