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W25Q02NWTBIM - Winbond

Description: New Family of SpiFlash Memories – W25Q02NW: four 512M-bit stack die (2G-bit / 256M-byte) – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – SPI/QPI DTR (Double Transfer Rate) Read – 3 or 4-Byte Addressing Mode – Software & Hardware Reset(1)  Highest Performance Serial Flash – 133MHz Standard/Dual/Quad SPI clocks – 266/532MHz equivalent Dual/Quad SPI – 66MB/S continuous data transfer rate – Min. 100K Program-Erase c

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PCB Footprints
W25Q02NWTBIM - Winbond PCB footprint - BGA - BGA - 24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 Ball Array)
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3D Models
W25Q02NWTBIM - Winbond  - 3D model - BGA - 24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 Ball Array)
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W25Q02NWTBIM Details

  • Manufacturer Part Number:

    W25Q02NWTBIM

  • Manufacturer:

    Winbond Electronics Corp

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