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W25Q128FVPIP - Winbond

Description: 3V 128M-BIT Serial Flash Memory With Dual/Quad SPI & QPI

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PCB Footprints
W25Q128FVPIP - Winbond PCB footprint - Small Outline No-lead - Small Outline No-lead - 10.2 8-Pad WSON 6x5-mm (Package Code P)
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3D Models
W25Q128FVPIP - Winbond  - 3D model - Small Outline No-lead - 10.2 8-Pad WSON 6x5-mm (Package Code P)
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W25Q128FVPIP Details

  • Manufacturer Part Number:

    W25Q128FVPIP

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SON

  • Package Description:

    6 X 5 MM, GREEN, WSON-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    0

  • Clock Frequency-Max (fCLK):

    104 MHz

  • JESD-30 Code:

    R-PDSO-N8

  • Length:

    6 mm

  • Memory Density:

    134217728 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    16777216 words

  • Number of Words Code:

    16000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    16MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3 V

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    5 mm

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W25Q128FVPIP Overview

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