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W25Q16JVSNJM - Winbond

Description:  New Family of SpiFlash Memories – W25Q16JV: 16M-bit / 2M-byte (2,097,152) – Standard SPI: CLK, /CS, DI, DO, /WP, /Hold – Dual SPI: CLK, /CS, IO0, IO1, /WP, /Hold – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – QPI: CLK, /CS, IO0, IO1, IO2, IO3 – SPI/QPI DTR(Double Transfer Rate) Read – Software & Hardware Reset  Highest Performance Serial Flash – 133MHz Single, Dual/Quad SPI clocks – 266/532MHz equivalent Dual/Quad SPI – 66MB/S continuous data transfer rate – Min. 100K Program-Erase cycles per sec

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PCB Footprints
W25Q16JVSNJM - Winbond PCB footprint - Small Outline Packages - Small Outline Packages - 8-Pin SOIC 150-mil (Package Code SN)
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3D Models
W25Q16JVSNJM - Winbond  - 3D model - Small Outline Packages - 8-Pin SOIC 150-mil (Package Code SN)
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W25Q16JVSNJM Details

  • Manufacturer Part Number:

    W25Q16JVSNJM

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Date Of Intro:

    2018-03-27

  • Manufacturer:

    Winbond Electronics Corp

  • YTEOL:

    0

  • Alternate Memory Width:

    1

  • Clock Frequency-Max (fCLK):

    133 MHz

  • Data Retention Time-Min:

    20

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.85 mm

  • Memory Density:

    16777216 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    2097152 words

  • Number of Words Code:

    2000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    2MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3 V

  • Seated Height-Max:

    1.75 mm

  • Serial Bus Type:

    QSPI

  • Standby Current-Max:

    0.000015 A

  • Supply Current-Max:

    0.02 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Type:

    NOR TYPE

  • Width:

    3.9 mm

  • Write Protection:

    HARDWARE/SOFTWARE

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W25Q16JVSNJM Overview

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